Heat Dissipating Material

Alumina

This large, simple grain alumina has rounded crystal edges, and enhances heat dissipation when mixed into various resins. It has excellent performance as a filler for rubbers, plastics, or sintered ceramics.

Characteristics

• High loading / high fluidity
• High purity
• Low abrasiveness

Applications and Lineup of Products

Heat dissipating sheet, Filler for heat dissipating substrate (MC substrate), heat dissipating grease, Phase change sheet, Filler for semiconductor encapsulation resin, Silicone-resin-based heat dissipating adhesive, Compound filler, Ceramics filter.

• Roundish Alumina/ AS
• Alunabeads™/ CB

Hexagonal boron nitride

A high purity crystallized white hexagonal boron nitride powder. With a layered structure similar to graphite, it has excellent lubricating and mold release properties.

Characteristics

• High thermal conductivity
• High thermal stability,
  High corrosion resistance,
  High electrical characteristics
• Lubricity and mold-release efficiency

Applications and Lineup of Products

For use with glass processing and metallurgy release agents, electrical insulation fillers, and thermal conductive fillers for various resins and rubber additives.

• SHOBN™/ UHP