Inquiries
Heat Dissipating Material
A ceramics filler that enhances heat dissipation from a resin when added into it.
Alumina
Lineup
This single-particle alumina improves heat dissipation when added to various resins. It demonstrates excellent properties as a filler for rubber or plastics.
Roundish Alumina AS
Alunabeads CB
Low-soda Alumina AL
Characteristics
High loading / high fluidity
High purity
Low abrasiveness
Applications
Heat dissipating sheet, Filler for heat dissipating substrate (MC substrate), heat dissipating grease, Phase change sheet, Filler for semiconductor encapsulation resin, Silicone-resin-based heat dissipating adhesive, Compound filler, Ceramics filter.
- Roundish Alumina AS
- Alunabeads CB
- Low-soda Alumina AL
Note
“Alunabeads” is a registered trademark of Resonac Corporation in Japan.
Hexagonal boron nitride
Lineup
A high purity crystallized white hexagonal boron nitride powder, it possesses excellent thermal conductivity and thermal stability. Due to its lubricating and release properties, it is also used in mold release applications.
SHOBN UHP
Characteristics
High thermal conductivity
High thermal stability,
High corrosion resistance,
High electrical characteristics
Lubricity and mold-release efficiency
Applications
For use with glass processing and metallurgy release agents, electrical insulation fillers, and thermal conductive fillers for various resins and rubber additives.
- SHOBN UHP
Note
“SHOBN” is a registered trademark of Resonac Corporation in Japan.
